Capability

Optimizing processes for performance is where our innovation begins.

Knowing the performance laminate materials and processes that meets critical achievement is how our experience nurtures excellence.

Manufacturing Specifications

	Commercial: Product is fabricated to IPC standards using UL and IPC-4101 approved materials.
	Best-Commercial: Product is fabricated to IPC 6011/6012, which includes a coupon microsection evaluation of plated through hole integrity. Coupons are sent to the customer, on request, with each shipment.
	Military: Product is fabricated to MIL-PRF-55110 including full Group A testing. Group A testing includes microsection evaluation for solderability, thermal stress, tin/lead thickness, and PTH hole integrity. IMI maintains test records per MIL SPEC requirements, and submits a Certificate of Compliance and coupons to the customer with each shipment when requested.
	Group B Testing: To the benefit of all our customers, we submit product samples each month to a DSCC approved independent testing laboratory, in order to maintain MIL-PRF-55110 qualification and assure that we meet those requirements. These tests verify that our products meet moisture and insulation resistance (168 hours, 20 cycles to 65 degrees C and 98% RH), dielectric withstanding voltage (1000V DC), and hole and land integrity after five solder and unsolder cycles (260 degrees C maximum tip temperature). The disciplines required to achieve the rigorous Group B results are imbedded in the fabric of all products that leave our shop.

Materials

	FR-4
	Polyimide
	Getek^®
	Teflon^®
	IPC-4101 material with HTE copper
	Mixed dielectrics

Production Fabrication Tolerances

The following parameters are standards for normal production jobs. More stringent features and tolerancing are available subject to engineering review.

Annular Ring (finish sizes)

Minimum Pad Diameter =
Outer layers: Finished Hole Diameter + 0.014" fabrication tolerance + minimum annular ring x 2
Inner layers: Finished Hole Diameter + 0.020" fabrication tolerance + minimum annular ring x 2

Thermal Pad -- Vcc/Gnd Plane (finish sizes)

Minimum Pad Diameter =
Finished Hole Diameter + 0.020" fabrication tolerance + minimum annular ring x 2

Clearance -- Vcc/Gnd Plane (finish sizes)

	Around PTH without pad: Finished Hole Diameter + 0.035"
	Around NPTH: Finished Hole Diameter + 0.015"

Clearance between any non-contact land areas (finish sizes)

Minimum 0.005"

Clearance -- solder mask to pads

	Screened epoxy mask: Pad diameter + 0.008" fabrication tolerance
	Photoimageable mask: Pad diameter + 0.005" fabrication tolerance

Finished Line Width

0.004" minimum

Copper Area (finish sizes)

	1/2 oz copper = Artwork - 0.0005" etch factor
	1 oz copper = Artwork - 0.001" etch factor
	2 oz copper = Artwork - 0.003" etch factor
	3 oz copper = Artwork - 0.008" etch factor
	4 oz copper = Artwork - 0.010" etch factor
	5 oz copper = Artwork - 0.012" etch factor

Tolerances

	Hole location accuracy: +/- 0.003"
	Feature-to-edge accuracy: +/- 0.005"
	NPTH Hole Diameter tolerance: +/- 0.002"
	PTH Hole Diameter tolerance: +/- 0.003"
	Finished Board Thickness: +/-10%
	Finished Board Flatness: +/- 0.01 in/in
	Line width for RF Applications: +/- 0.001

Teflon^®

IMI, Inc. Printed Circuit Boards processes all types of Teflon^®based materials; GT, GX, GY, and GR. End product uses include: Antennas, Microstrips, Striplines, and Amplifiers. IMI, Inc. is capable of manufacturing to commercial specifications for both quick-turn and standard lead times.

Teflon^® material is one of the most highly used materials in the Wireless Market.

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IMI is your microwave PCB expert. Let IMI do your next prototype.